APEC 2025 | ROHM Semiconductor

We want to express our sincere gratitude for your participation at APEC 2025 last week. It was a pleasure to connect with each of you and share insights and experiences. We truly appreciate you taking the time to join us and contribute to the vibrant discussions and networking opportunities. We hope you found the event valuable and informative.

Thank you once again for your presence and engagement. We look forward to staying connected and seeing you at future events.

• SiC Power Devices

• Power Devices & Gate Drivers

• Evaluation Using the SpeedVal Platform

• Powered By ROHM (customer collaboration demos)

• EcoGan™ Solutions

Exhibitor Sessions

Presenter: Ming Su, PhD. Technical Marketing Manager, ROHM Semiconductor

TRCDRIVE pack™, A Compact High-Power SiC Module for Electric Vehicle Propulsion Systems

Tuesday, February 27, 2024 | 3:00 PM – 3:30 PM | Location: Exhibitor Presentation Theater 3

Presenter: Kengo Ohmori, Technical Product Marketing Manager, ROHM Semiconductor

High Voltage GaN HEMT (EcoGaN) and SiP Solution for Power Systems

Wednesday, February 28, 2024 | 12:45 PM – 1:15 PM | Location: Exhibitor Presentation Theater 1

Technical Session
		Presenter: Shuichiro Motoori, Engineer, ROHM Co., LTD T01.8 - Miniaturization of AC-Adapter Realized by Primary Voltage-Clamper with Mid-Voltage (150V) AHB Converter Tuesday, February 27, 2024 \| 11:20 AM – 11:40 AM \| Location: 101A
Industry Session
		Presenter: Oji Sato, Group Leader, ROHM Co., LTD IS23.4 - Achieving Thermal Shock Reliability Enhancement Against Thick Cu Substrate in Die Attach with a High Thermal Conductive Foil Thursday, February 29, 2024 \| 9:45 AM – 10:10 AM \| Location: 201B
Dialogue Session
		Presenter: Toshiyuki Zaitsu, PhD, Engineer ROHM Co., LTD D02.5 - Compact Hardware Implementation of Power Factor Control for LLC Converter with Event-Driven-Timer Based Digital Controller Thursday, February 29, 2024 \| 11:30 AM – 1:30 PM \| Location: Grand Ballroom AB

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Agenda

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Event's registration

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APEC 2022

Join ROHM at the APEC 2022 conference, where we showcase our latest solutions and technologies for power applications for automotive and industrial. Register here

Power is quickly becoming one the most important factors in many areas, driving technological innovation brought on by the need to conserve power as devices and systems consume ever increasing amounts of power in pursuit of greater sophistication and functionality. ROHM has been at the forefront of power in the semiconductor industry for many years, continuously releasing breakthrough products ahead of the competition, including next-generation SiC

DEMO HIGHLIGHTS
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• USB PD (BD93F10MWV-EVK-001, BD91N01NUX - EVK-001)		• EMARMOUR™ High EMI Tolerant Op Amps

• Scalable PMIC (BD9680x)		• 3pin/4pin Half Bridge Board (P02SCT3040KR- EVK-001)

• Buck DC/DC for EVs/HEVs and Industrial Equipment (BD9V101MUF-LB)		• IGBT with SiC SBD (RGWxxTSxxC)

• Nano Energy Buck (BD70522GUL)		• LED Drivers (BD18347EFV-EVK-101)

• Partner Demos w/Midnite Solar and Apex Microtechnology "Powered by ROHM"

Session IS11.1

– A New Comparator-Less Miller Clamp Circuit for SiC MOSFET to Prevent Self-Turn-On

Presenter: Mitch Van Ochten, Senior Applications Engineer, ROHM Semiconductor | Co-presenter: Shinya Tajima, Engineer

Wednesday, March 23, 2022 | 2:30 PM – 2:55 PM | Location: 360ABC

Session IS19.1

– New Control System for SPS's High Active Clamp Energy

Presenter: Mitch Van Ochten, Senior Applications Engineer | Co-presenters: Toru Takuma, Shuntaro Takahashi, Hajime Okuda

Thursday, March 24, 2022 | 8:30 AM – 8:55 AM | Location: 320B

Session IS16.2

– High Efficiency 3-Phase Power Inverter Using SiC MOSFET and Trans-Linked Neutral-Point-Clamped Topology

Presenter: Ming Su, PhD. Technical Marketing Manager, ROHM Semiconductor | Co-presenters: Tatsuya Miyazaki, Yuta Okawauchi, Ken Nakahara, Mamoru Tsuruya

Thursday, March 24, 2022 | 8:55 AM – 9:20 AM | Location: 360ABC

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